ASML plans chipmaking tools for AI beyond EUV

ASML told Reuters it is expanding beyond its EUV lithography business into advanced packaging and other chipmaking tools, and its chief technology officer said the company is researching longer-term directions including whether it can print larger chip sizes.

ASML told Reuters it plans to expand its chipmaking equipment lineup beyond its core extreme ultraviolet (EUV) systems to serve the growing artificial intelligence chip market. The company has been the sole maker of EUV systems after more than a decade of development and has a next-generation EUV product nearing production. ASML is exploring tools for advanced packaging that glue and connect specialized chips and is researching whether it can expand the maximum chip size its lithography systems can print. The company also plans to deploy AI across new businesses and legacy efforts, and it reorganized its technology unit in January after promoting Marco Pieters to chief technology officer in October. Key points: - ASML is the only maker of extreme ultraviolet (EUV) equipment, which is used for lithography to print patterns on silicon wafers. - The article mentions ASML has invested billions in EUV development and has a next-generation EUV system nearing production. - ASML is stepping up plans to build machines for advanced packaging to glue and connect multiple specialized chips. - The company is researching whether it can expand the maximum chip size its systems can print beyond current limits. - Marco Pieters was promoted to chief technology officer in October and ASML reorganized its technology business in January; the article mentions investors have high expectations of company leadership. Summary: ASML's announced plans would broaden its role in the AI chip supply chain beyond lithography to areas such as packaging and chip scaling. The company has a next-generation EUV system nearing production while it researches participation in packaging markets and larger print sizes. Undetermined at this time.